1 Lamination | 2 EDS line | ||
Open material | 4 Baking sheet | ||
5 drilling | 6 PTH | ||
plating | 8 Automatic filming | ||
Film inspection | 10 LDI counterpoint exposure | ||
11 Line development | 12 Line QC | ||
13 Graphic plating | 14 Etching | ||
NAME | 16 Pre-treatment of solder mask | ||
Silk screen | 18 CCD alignment exposure | ||
19 Solder mask development | 20 Solder Mask QC | ||
twenty one After baking | twenty two Text printing | ||
twenty three Gong machine forming | twenty four Automatic V-Cut | ||
25 Cleaning | 26 test | ||
27 FQC | 28 FQA | ||
29 Package | 30 Shipment |